Products

Production is focused on high-tech, multilayer and bilayer circuits with batches that go from samples to pre-production to the medium series.

	Single/Double Layer	MultiLayer	Finishes
	Standard and fine lines.	From 4 to 40 Layers.	Flash Electrolytic Gold Plating.
	Width Conductor min 50 µm.	Width Conductor min 40 µm.	Hot Air Solder Leveling (LF and Sn/Pb).
	Insulation min 50 µm.	Insulation min 40 µm.	Hard Gold Plating.
	Min Hole Size 0.1 mm.	Min Hole Size 0.1 mm.	Chemical Gold Plating.
		SBU	OSP
		Buried and Blind Vias.	Bonding Gold.
	Thickness CS min 0.25 mm.	Thickness CS min 0.50 mm.	Peelable Ink.
		Max Back Panel 6 mm.	Carbon.
	Max Size 800 x 550 mm.		Chemical Tin.

 

Structure & Sales

Export sales have attained a level of 70% at fima. The purchase of the company's printed circuits have been particularly heavy in the EU markets, specially in Germany, France, Austria, Switzerland, Belgium and Holland. Sales are also growing constantly in U.S.A., China, Japan and Indonesia.

 

ISO 9001 certification for system quality was received from the DNV Italia in accordance with the standard "UNI EN ISO 9001: 2000 (ISO 9001:2000)" for the production of multilayer, bilayer and monolayer printed circuit boards.