Laser Microvias and SBU Technology
(Sequential Build Up) technology is used for HDI circuits
requiring several lamination and drilling levels: drill
sizes down to 50 μm, track and gap width down to 25 μm are
their main features. This technology is available at FIMA
and is performed by LDI machines to print inner layers,
outer layer and solder mask whilst laser drilling machine is
used to drill the blind microvias.