can produce printed circuit boards with very dense
interconnections (HDI), very fine lines and gaps (down to 25
μm). Usually these PCBs have buried vias, simple, staggered,
stacked blind microvias over several levels: the production
of HDI boards is made easy by the use of laser technology.
Available surface finishings on these PCBs are: ENIG, ENEPIG
and Immersion Tin.